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Programs Catalog

Programs Catalog

INNOVATION HUB & LOUNGE —
New Innovative Ideas Start Here! 

Look What's Happening on the First Floor, in the Bayshore Foyer.
 

Innovation and Start-up Company Kiosks

Connect with leading Research Universities & Institutions and Start-Up companies to see breakthroughs in Flexible Hybrid, MEMS, Sensors, Materials, Applications, and other exciting enabling technologies.

Interested in exhibiting? Contact Eric Rude, erude@semi.org or 1.408.943.7047. 

Product Showcase

SEMI-FlexTech R&D programs are unique examples of public/private partnerships. The U.S. Department of Defense granted SEMI-FlexTech multiple contracts to fund cooperative technology development. The three programs under SEMI-FlexTech management include:

  • FlexTech (Flexible Electronics)
  • Nano-Bio Materials Consortium (MedTech)
  • NextFlex, America’s Flexible Hybrid Electronics Manufacturing Institute, which operates as a semi-autonomous consortium. 

There are new opportunities in “Positioning, Navigation and Timing” to learn more attend FLEX Session 17: Manufacturing USA, or stop by the product showcase to view completed projects.

  • NOW ACCEPTING—Proposals for Funding for Positioning, Navigation & Timing Projects
  • Read the full solicitation for more details.

TechTALKS

Like the show and tell of yesteryear, indulge your curious nature with technical experts sharing their expertise through short 15-minute presentations. Experience lively audience interaction during the Q&A + find answers to your technology questions.

Student Poster Session

View thought-provoking posters on innovative technology projects by students from leading research universities

The Student Poster ideas represent the same conference topics for FLEX and MSTC. Students are competing for trophies judged by a distinguished panel of industry experts, so they are ready and prepared to present their research to you.

Join us to see if your favorite poster wins—

Student Poster Award Ceremony
Wednesday, February 26
6:00–6:45pm, Second Floor, Gateway Foyer

Job Board

Post your organization’s employment openings in printed, flexible hybrid, MEMS, and sensors at FLEX MSTC!  Open to all for posting or reviewing these industry opportunities.

Contact Michelle Fabiano at mfabiano@semi.org for more information.

Topic Lounge

Not your typical area—Refresh. Rest. Renew your energy in the Topic Lounge.
Escape the conference activities to delve deeper into a conference topic, enjoy conversation with a long-time colleague, or enrich new connections.

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MEMS & SENSORS TECHNICAL CONGRESS — MSTC 2020

TECHNOLOGIES DRIVING THE NEXT WAVE OF SMART MEMS & SENSING SOLUTIONS

Tuesday, February 25        8:00am–6:00pm
Wednesday, February 26   8:00am–6:00pm 

MSTC AGENDA


NEW VENUE!

MSTC 2020 hosted at the DoubleTree by Hilton in San Jose, California. The venue is conveniently located less than one mile from the San Jose International Airport! 

The MEMS & Sensors Technical Congress — MSTC 2020 is designed for technical executives, engineering, design and product engineers across the MEMS and sensors supply chain and adjacent industries. This year will see a different format to truly focus on the needs of the key innovators in our industry.  MEMS and sensors technology challenges from silicon fabrication, packaging, test, hardware, and software design will be addressed together with the impact of adjacent technologies of the ecosystem.  The opportunities and challenges brought about by key growth areas such as Artificial Intelligence, Machine Learning, 5G, and Blockchain will be front and center. The existing and emerging MEMS and sensors markets together with the resulting new component, software, and systems needs will be highlighted. MSTC features key networking and problem-solving discussions and opportunities for all attendees. 

WHO SHOULD ATTEND?

  • CTOs
  • Senior Technical Executives
  • Executive Vice Presidents of Technologies
  • Engineering Vice Presidents, Directors, Managers, and Designers
  • System Engineers and Integrators
  • Software Solutions Engineers and Developers
  • Startup Founders
  • Academia
  • Research and Development Engineers
  • Market Analysts
  • Market Researchers
  • Consulting Firms

MSTC 2020 SPEAKER SELECTION COMMITTEE 

Thank you to these prestigious industry leaders for their time and guidance. 

  • Michael A. Helmbrecht, PhD, Product Development & Manufacturing, AM Fitzgerald 
  • Tony Zarola, General Manager, Analog Devices (ADI) 
  • Andre Rouzaud, PhD, Microsystem, Deputy VP, CEA-Léti
  • Nicole Kerness, Senior Director of Product Management, QST Solutions
  • Evgeni Gousev, PhD, Senior Director, Qualcomm Technologies
  • Uma Krishnamoorthy, Director, Robert Bosch
  • Thomas Kenny, PhD, Richard Weiland Professor and Senior Associate Dean of Engineering, Student Affairs, Stanford University
  • Mahesh Chowdhary, PhD, Director & Fellow, Strategic Platforms and IoT Excellence Center, STMicroelectronics
  • Tia Williams, Texas Instruments

 

THERE'S STILL TIME FOR YOU TO PARTICIPATE—SHARE YOUR EXPERTISE!

MSTC CALL FOR ABSTRACTS ACCEPTING APPLICATIONS 

SEMI, the MEMS & Sensors Industry Group (MSIG), and the MEMS & Sensors Technical Congress (MSTC) Speaker Selection Committee invite you to submit an abstract for one or more of the following areas:

  • TechTALKS Demonstration and Presentation

  • Student Poster Display and Competition

Event Contact

Lin Tso
Sr. Program & Event Manager, SEMI
ltso@semi.org

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STUDENT POSTERS AT FLEX / MSTC 2020!

Sponsor—
            

 

See and Discuss Innovative Poster Topics with Students from Top Universities

Tuesday,       9:30am–6:00pm
Wednesday, 9:30am–4:15pm  
Bayshore Foyer in front of the Exhibit Hall

 

Multilayer Substrates with Aerosol-Jet Print Process
Kartik Goyal, Auburn University

Vaper Phased Polymerized PEDOT/Cellulose Paper Composite for Flexible Solid-State Supercapacitor
Boxiao Li, Binghamton University

Fabrication of a Stretchable Electronic Decal by Aerosol Printing
Derya Tansel, Carnegie Mellon University

Flash Ablation Metallization of Conductive Thermoplastics
Jorge Cardenas, Duke University

5G Ambient mm-Wave Power is Coming: Get Your Stickers Ready!
Aline Eid, Georgia Institute of Technology

Comprehensive Testing Strategies for Flexible Screen-Printed Inks
Benjamin Stewart, Georgia Institute of Technology

Low-Cost Passive Wireless Sensors for Widespread and Distributed Soil Health Monitoring
Sarath Gopalakrishnan, Purdue University

A Soft Probe Unit for Flexible Electronic Device Inspection Using Conductive Silicone Elastomer Composite
Jiseok Seo, Seoul National University

Soft Modular Electronic Blocks (SMEBs) for Tailored Wearable Health-Monitoring System
Jaeyoung Yoon, Seoul National University

Low Power Mixed-Signal Systems for Edge-AI Applications
Sanjeev Tannirkulam Chandrasekaran, University at Buffalo–SUNY

High Yield Selective Precision Transfer and Assembly of GaN microLEDs on FlexTrateTM
Goutham Ezhilarasu, University of California, Los Angeles

Continuous Manufacturing of Flexible and Stretchable Substrates for Printed Electronics
Shruti Deshmukh, University of Massachusetts Lowell

 

 

Specifications and Instructions for Poster DisplaysSTUDENT POSTER INSTRUCTIONS 

 

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Monday, February 24 (All day)

Before, Between, and After the Sessions

Experience FLEX/MSTC Networking at its FINEST!
 

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FLEX Sessions, MSTC Sessions Bayshore Foyer Monday, February 24
2:00pm to 6:30pm
FLEX Sessions, MSTC Sessions Monday, February 24
4:00pm to 5:30pm

DiversityWomen in Tech 

  

Back by popular demand, the Women inTech returns to FLEX 2020 as a Happy Hour! All conference attendees are welcome.

Join us for a discussion around diversity and mentoring in the electronics design and manufacturing industry.

Diversity in the general workforce and leadership positions has been proven to make companies more successful and lead to varied and more effective problem-solving. It’s possible to revise this contradictory juxtaposition through policies and programs which counter the bias and show the possibilities to upcoming classes of engineers and scientists.

Join this one-hour meeting and discussion and drive change at your organization. A review of the recent McKinsey study on the electronics industry diversity scorecard will be followed by a speed networking opportunity and then a half-hour mixer.

Explore and share paths which lead to a bias-free working environment and better overall results.

 

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Receptions, Networking, FLEX Sessions, MSTC Sessions Gateway Foyer Monday, February 24
5:30pm to 6:30pm

FLEX/MSTC WELCOME RECEPTION

Please join us to kick-off the FLEX and MSTC week. Enjoy Conversation, Camaraderie, and Refreshments!

 

             

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Networking, FLEX Sessions, MSTC Sessions Gateway Foyer Tuesday, February 25
7:00am to 8:00am

Networking Breakfast

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Keynotes & Executive Panels, FLEX Sessions, MSTC Sessions Gateway Ballroom Tuesday, February 25
8:00am to 9:00am

SESSION 1: KEYNOTES (FLEX/MSTC)

Session Chair: Michael McCreary, E Ink Corporation​

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Networking, FLEX Sessions, MSTC Sessions Exhibit Hall Tuesday, February 25
9:30am to 10:30am

Morning Break

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Keynotes & Executive Panels, FLEX Sessions, MSTC Sessions Gateway Ballroom Tuesday, February 25
10:30am to 12:15pm

SESSION 2: KEYNOTES (FLEX/MSTC)

Session Chair: Michelle Bourke, LAM Research

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Networking, FLEX Sessions, MSTC Sessions Tuesday, February 25
12:15pm to 1:50pm

NETWORKING LUNCH

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MSTC Sessions Tuesday, February 25
1:50pm to 4:00pm

SESSION 2: Industry Trends and Applications of MEMS & Sensors

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FLEX Sessions Pine Tuesday, February 25
2:00pm to 3:45pm

SESSION 3: FHE Applications

Session Chair: Kei Hyodo, Yuasa System Co. Ltd.

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FLEX Sessions Fir Tuesday, February 25
2:00pm to 3:45pm

SESSION 4: Materials

Session Chair: Robert Praino, Chasm Advanced Materials

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FLEX Sessions Oak Tuesday, February 25
2:00pm to 3:45pm

SESSION 5: Displays & Optoelectronics I

Session Chair: Michael McCreary, Eink

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Paul Drysch
PreAct Technologies
TechTALKS Tuesday, February 25
2:15pm to 2:30pm
Jeffrey Krotosky
Tronics MEMS / TDK Electronics
TechTALKS Tuesday, February 25
2:45pm to 3:00pm
Receptions, Networking, FLEX Sessions, MSTC Sessions Exhibit Hall Tuesday, February 25
4:00pm to 6:00pm

Networking Reception 

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Networking, FLEX Sessions, MSTC Sessions Gateway Foyer Wednesday, February 26
7:00am to 8:30am

CONTINENTAL BREAKFAST

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FLEX Sessions Wednesday, February 26
8:00am to 9:25am

SESSION 6: Power

Session Chair: Mark Poliks, Binghamton University

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FLEX Sessions Fir Wednesday, February 26
8:00am to 9:25am

SESSION 7: Substrates & Barriers

Session Chair: Doyle Edwards, Brewer Science

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FLEX Sessions Oak Wednesday, February 26
8:00am to 9:25am

Session 8: Displays & Optoelectronics II

Session Chair: Eric Forsythe, Army Research Laboratory
 

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MSTC Sessions Wednesday, February 26
8:30am to 9:25am

MSTC SESSION 4: Emerging  Manufacturing Innovations for Sensors and MEMS 

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Networking, MSTC Sessions, FLEX Sessions Exhibit Hall Wednesday, February 26
9:35am to 10:25am

Networking Break

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FLEX Sessions Fir Wednesday, February 26
10:25am to 11:50am

SESSION 10: Printing Technologies

Session Chair: Robert Praino, Chasm Advanced Materials
 

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FLEX Sessions Oak Wednesday, February 26
10:25am to 11:50am

SESSION 11: Reliability—Characterization

Session Chair: Erica Montbach, Kent Display

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FLEX Sessions Pine Wednesday, February 26
10:25am to 11:50am

SESSION 9: Sensors

Session Chair: Pavel Dutta, Lumileds

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MSTC Sessions Wednesday, February 26
10:25am to 12:00pm

MSTC SESSION 4: Emerging  Manufacturing Innovations for Sensors and MEMS 

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Naotsugu Ando
YUASA SYSTEM
TechTALKS Wednesday, February 26
10:30am to 10:45am
Jay Esfandyari
STMicroelectronics
TechTALKS Wednesday, February 26
10:45am to 11:00am
Bao Tran
T-Technology
TechTALKS Wednesday, February 26
11:00am to 11:15am
Networking, FLEX Sessions, MSTC Sessions Wednesday, February 26
11:50am to 1:30pm
FLEX Sessions Pine Wednesday, February 26
1:30pm to 3:15pm

SESSION 12: FHE Medical/Wearable Applications

Session Chair: Stephen Farias, NanoDirect LLC

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FLEX Sessions Fir Wednesday, February 26
1:30pm to 3:15pm

SESSION 13: State of the Art FHE Manufacturing​​

Session Chair: Scott Miller, NextFlex

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FLEX Sessions Oak Wednesday, February 26
1:30pm to 3:15pm

SESSION 14: Reliability—Metrology

Session Chair: Doyle Edwards, Brewer Science

 

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MSTC Sessions Wednesday, February 26
1:30pm to 3:05pm

MSTC SESSION 5: IOT—From Components to Solutions

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Carolyn Ellinger
Eastman Kodak Company
TechTALKS Wednesday, February 26
1:45pm to 2:00pm
Amit Lal
Geegah LLC, Cornell University
TechTALKS Wednesday, February 26
2:00pm to 2:15pm
Shomeek Mukhopadhyay
Obsidian Advanced Manufacturing
TechTALKS Wednesday, February 26
2:15pm to 2:30pm
Albert Lu
Interlink Electronics
TechTALKS Wednesday, February 26
2:45pm to 3:00pm
Networking, FLEX Sessions, MSTC Sessions Exhibit Hall Wednesday, February 26
3:15pm to 4:15pm

Networking Break

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MSTC Sessions Wednesday, February 26
4:00pm to 5:55pm

MSTC SESSION 6: VC (Investors) & Startups 

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FLEX Sessions Pine Wednesday, February 26
4:15pm to 6:00pm

SESSION 15: Heterogeneous Integration of Flexible Electronics

Session Chair: Pavel Dutta, Lumileds​

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FLEX Sessions Fir Wednesday, February 26
4:15pm to 6:00pm

SESSION 16: 3D Printed Electronics: From Devices to Systems

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FLEX Sessions Oak Wednesday, February 26
4:15pm to 6:00pm

SESSION 17: Manufacturing USA

Session Chair: Eric Forsythe, Army Research Laboratory

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FLEX Sessions, MSTC Sessions Wednesday, February 26 6:00pm

2020 FLEXI AWARDS and STUDENT POSTER
AWARD CEREMONY & RECEPTION

Join us to honor the FLEXI Awards Recipients and the Student Poster Winners
 

Wednesday, February 26
6:00–6:45pm
Gateway Foyer

 

FLEX/MSTC 2020 STUDENT POSTERS

INNOVATIVE IDEAS from Top University Students on Display
Gateway Foyer (outside the Exhibit Hall)  

  • Tuesday, February 25, 9:45am–6:00pm
  • Wednesday, February 26, 9:25am–4:00pm

 

2020 FLEXI AWARD

The FLEXI Awards recognizes the achievements of organizations and individuals in the flexible electronics sector in the categories of:

  • Innovation & Commercialization

  • R&D

  • Education Leadership

  • Industry Leadership

  • Technology Champion


___________________________________

FLEXI AWARDS & CRITERIA 

  • PRODUCT INNOVATION AWARD CRITERIA: Entries for this award should be on a flexible electronics product announced in the last twelve months and are awarded to the organization responsible for its creation. Nominations will be judged based on the product design & ingenuity, potential (or proven) market adoption, and revenue generation. Products must be available to customers at the time of nomination.
     
  • R&D ACHIEVEMENTS AWARD CRITERIA: Entries for this award are evaluated for their world-class research approach, originality, and commercial potential for expanding the scope for flexible or printed electronics or their manufacturing processes. Consideration is given to the ability of entrants to identify and solve a real problem.
     
  • TECHNOLOGY LEADERSHIP IN EDUCATION AWARD CRITERIA: This award recognizes and honors outstanding contributions to the flexible electronics industry through education, both via a certified education institution or internal corporate workforce development activity. Judging is based on the quality of education, practical applicability, number of students completing the course, and degree of focus on flexible, printed electronics.
     
  • INDUSTRY LEADERSHIP AWARD CRITERIA: This award will recognize and honor an individual who has shown particular dedication to building awareness of the capabilities and possibilities that flexible and hybrid electronics bring to the broader field of electronics. The individual honored will have demonstrated outstanding leadership for the industry in public forums, association activity, and within their organization.
     
  • TECHNOLOGY CHAMPION AWARD CRITERIA: This award will recognize and honor an individual for their volunteering efforts and contributed achievements in the flexible and hybrid electronics industry. 

The FLEXI Awards are awarded annually by FlexTech based on the stated criteria. A panel of industry experts come together once a year to evaluate the submissions and determine the award. The FLEXI Award does not constitute an implicit endorsement of the recipient or its products.

PAST FLEXI AWARD WINNERS


 

 

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Networking, FLEX Sessions, MSTC Sessions SEMI HQ - The Valley Thursday, February 27
8:30am to 9:00am

Continental Breakfast

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Thursday, February 27 9:00am

See the list of Tech Courses here. 

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FLEX Sessions, MSTC Sessions Thursday, February 27
9:00am to 12:00pm

Tech Courses FLEX/MSTC

Location: SEMI HQ | 673 S. Milpitas Blvd |  Milpitas, CA 95035

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Networking, FLEX Sessions, MSTC Sessions SEMI HQ - The Valley Thursday, February 27
12:00pm to 1:30pm

FLEX and MSTC Networking Luncheon

Learn and Network 

Thursday, February 27
12:00–1:30pm

NEW VENUE!  |  SEMI HQ  |  Valley Room
673 S. Milpitas Blvd.
Milpitas, CA 95035

Cost: FREE for all attending the FLEX/MSTC conference, Tech Course, and invited members.
 
Space is limited—RSVP When you register for FLEX / MSTC!

Join us for an enjoyable and relaxing opportunity to network with friends and colleagues over an informal luncheon at the SEMI headquarters in Milpitas. 

You'll learn how your membership association works for YOU and your company! Here's a unique chance to engage directly with SEMI staff to learn more about our:

  • Membership Benefits and Services

  • Global Programs and Events

  • Public Policy & Advocacy

  • Products and Smart Initiatives

  • Funding Opportunities

  • SEMI International Standards

  • Strategic Association Partners:

    • FlexTech

    • MEMS & Sensors Industry Group—MSIG

    • Electronic System Design Alliance—ESDA

    • Fab Owners Alliance—FOA
       

                       Happy  50th Anniversary SEMI!

Come lunch, network, and celebrate with SEMI as we look ahead

                  to 50 more years of industry leadership!

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NEXTFLEX | 2244 Blach Place, Suite 150 | San Jose, CA 95131 Friday, February 28
9:00am to 11:00am

Tour the NextFlex Technology Hub where design, prototyping and pilot-scale manufacturing of flexible hybrid electronics is transforming the way we think about electronics. Led by NextFlex technical staff, view five types of printing, thin die integration and assembly, and the testing lab in action. Now ITAR and FDA compliant, the NextFlex Technology Hub are delivering on the promise of next-generation electronics that bend, flex and stretch. 

  • FREE Tour 
  • ​Limited to 100 Guests
  • Transportation Not Provided
  • NextFlex has the right to approve attendance 

Four 30-minute tours and can take up to 25 people on each tour. Attendees do not need to sign up for a time. They will just be put on the tour depending on what time they arrive. The last tour will be given at 10:30 am

 

 

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Networking, FLEX Sessions, MSTC Sessions NEXTFLEX | 2244 Blach Place, Suite 150 | San Jose, CA 95131 Friday, February 28
9:00am to 11:00am

TOUR: NextFlex Technology Hub

Tour the NextFlex Technology Hub where design, prototyping and pilot-scale manufacturing of flexible hybrid electronics is transforming the way we think about electronics. Led by NextFlex technical staff, view five types of printing, thin die integration and assembly, and the testing lab in action. Now ITAR and FDA compliant, the NextFlex Technology Hub are delivering on the promise of next-generation electronics that bend, flex and stretch. 

  • FREE Tour 
  • ​Limited to 100 Guests
  • Transportation Not Provided
  • NextFlex has the right to approve attendance 

Four 30-minute tours and can take up to 25 people on each tour. Attendees do not need to sign up for a time. They will just be put on the tour depending on what time they arrive. The last tour will be given at 10:30 am

 

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